Built around your application.

Connections for cooling infrastructure.

Cooling distribution units and server liquid-cooling circuits bring specific requirements for sealing, fluid compatibility and maintenance access.

Key project considerations

• Coolant chemistry and wetted-material compatibility
• Operating pressure, temperature and leak-test criteria
• Connection interfaces and installation clearances
• Maintenance, isolation and serviceability

Data-center coolant connections require a separate pressure, coolant and sealing review. Vacuum components on this site must not be assumed suitable for a pressurized cooling circuit.

Specify for the process.

Semiconductor, precision electronics, pharmaceutical and battery-production projects can have very different fluid-system requirements.

Key project considerations

• Process media and corrosion compatibility
• Cleanliness, surface finish and handling requirements
• Pressure, temperature and joining methods
• Applicable standards and documentation

Suitability for high-purity, special-gas or regulated processes must be verified for the specific product and application.

See more of the process.

Equipment categories for wafer inspection, post-bond quality review and advanced semiconductor packaging inspection.

Define your inspection task

• Wafer surface quality and subsurface micro-cracks
• 2D surface inspection and 3D bump metrology
• Wirebond, die and epoxy inspection
• Substrate surfaces and internal package defects

Flexibility for vacuum systems.

Flexible tubes, formed bellows and flanges for semiconductor equipment, display manufacturing, analytical instruments and industrial vacuum piping.

Define the connection

• Internal vacuum and external pressure conditions
• Connection family, material and sealing system
• Vibration, movement and installation offsets
• Leak-test method, cleanliness and documentation